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Technology of Adhesives and Wood-Based Panels

By Manfred Dunky
Series: Adhesion and Adhesives: Fundamental and Applied Aspects
Copyright: 2025   |   Expected Pub Date:2025/06/30
ISBN: 9781394174591  |  Hardcover  |  
652 pages

One Line Description
The book provides essential insights into the critical role of adhesive bonding in maximizing the value of wood products, equipping both students and industry professionals with the knowledge necessary to enhance production processes and improve product performance.

Audience
Engineers, chemists, scientists, researchers, students, production managers and technologists in the wood, wood-based panel, and adhesive industries.

Description
Adhesive bonding of wood is a key factor in the efficient utilization of wood for the production of value-added wood products, such as wood-based panels. The production of wood-based panels requires high-performance bonds between wood adherends and the properties of these wooden products are largely determined by the type and performance of the adhesive used. Technology of Adhesives and Wood-Based Panels comprehensively covers wood-based panels, focusing on the technologies behind their raw materials and their production. Journey through the production process: starting with the raw materials, then application of adhesives onto the wood’s surfaces, pressing the mat to the board, and curing or solidifying the adhesive. Finally, this journey will culminate in an investigation of the properties of the bondline in wood-based panels. This volume explores important concepts, including the influence of wood materials and surface on wood bonding, the performance of wood-based panels, the production technology of panels, and the behavior of adhesives when applied to wood surfaces, making it a valuable resource to industry professionals and students alike.
Readers will find that this book:
• Introduces wood adhesives and their chemistry and applications;
• Comprehensively covers the technology of wood-based panels;
• Explores connections for properties and performance between adhesives and bonded products;
• Provides recent developments in wood adhesives and wood-based panels.

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Author / Editor Details
Manfred Dunky has over 40 years of experience in the chemical and wood-based panels industry as a researcher and application manager, continuing now as a consultant for this industry. He earned his doctoral degree in 1980 from the University of Leoben, Austria. He is the author of two comprehensive books, (co-)editor of several conference proceedings, and of about 50 original and extensive review papers on synthetic and natural adhesives and wood-based panel technology. During his career, he worked with synthetic wood adhesives as well as with adhesives based on natural resources and their application in panel production. Besides his industry career, he is has lectured at universities for 30 years and in 2000 received his habilitation (post-doctoral lecturing qualification) for “Wood Science with special consideration of wood-based panels“. He speaks regularly at international wood science conferences.

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Table of Contents
Preface
Acknowledgments
1. Introduction
1.1 Wood-Based Panels
1.1.1 Plywood and Solid Wood-Type Panels
1.1.2 Panels Based on Strands and Particles
1.1.3 Panels Based on Fibers
1.1.4 Composites
1.1.5 Taylor-Made Wooden Products (Functional Boards)
1.1.6 Wood–Plastic Composites (WPC)
1.2 Production of Wood-Based Panels
1.3 Factors for Selecting an Adhesive
1.4 Interdisciplinary Approach to Wood-Based Panels
1.4.1 Forestry
1.4.2 Wood Anatomy (Structure of Wood as Raw Material)
1.4.3 Wood Physics and Mechanics
1.4.4 Wood Technology
1.4.5 Wood Chemistry
1.4.6 Biotechnology
1.4.7 Organic Chemistry and Type and Composition of Adhesives
1.4.8 Process Technology
1.4.9 Ecological Sciences and Circular Economy in Forestry and Wood Industry
1.4.10 Economic Sciences
1.5 Summary of Actual Developments with Wood-Based Panel
2. Components
2.1 Wood
2.1.1 Characteristics and Structure of Wood and Wooden Raw Materials
2.1.1.1 Wood Species
2.1.1.2 Recycled and Waste Wood, Cascade Use of Wood
2.1.1.3 Density and Porosity
2.1.1.4 Wood Surface and Mechanical Weak Boundary Layer (MWBL)
2.1.2 Size and Size Distribution of Particles, Flakes, and Strands
2.1.3 Refining Process and Fiber Quality
2.1.4 Moisture Content
2.1.5 Chemical Behavior of Wood
2.1.5.1 Analysis and Chemical Composition of Wood and Wood Surfaces
2.1.5.2 Wood-Inherent Chemicals (Extractives)
2.1.5.3 Acid Content and Buffer Capacity, pH of the Wood Surface
2.1.5.4 Age of Wood Surfaces, Inactivation
2.1.5.5 Formaldehyde in Wood
2.1.5.6 Seasonal Variations of the Wood Quality
2.1.6 Chemical and Physical Activation, Modification, and Pre-Treatment of Wood and Wood Surfaces
2.1.6.1 Modification and Activation of the Wood Surface by Chemical and Thermochemical Treatment
2.1.6.2 Citric Acid
2.1.6.3 Thermal and Physical Pre-Treatments of Wood
2.1.6.4 Hydrothermal Treatment (Steam Pre-Treatment)
2.1.6.5 Enzymatic Pre-Treatment of the Wood Surface
2.1.6.6 Binderless Bonding (Bonding Without Use of an External Adhesive, Adhesive-Free Bonding)
2.1.7 Biofibers and Plant Raw Materials
2.1.8 Modified Wood
2.2 Adhesives
2.2.1 Formaldehyde Condensation Resins
2.2.1.1 Aminoplastic Resins
2.2.1.2 Phenol- and Resorcinol-Based Resins
2.2.1.3 Molar Mass Distribution
2.2.1.4 Reactivity and Hardening Reactions
2.2.2 Isocyanate and Polyurethane Adhesives
2.2.2.1 Chemistry of Isocyanate Adhesives
2.2.2.2 Polyurethane Adhesives
2.2.2.3 Emulsion Polymer Isocyanate (EPI)
2.2.3 Adhesives Based on Natural Resources
2.2.3.1 Protein-Based Adhesives
2.2.3.2 Carbohydrate-Based Adhesives
2.2.3.3 Tannin-Based Adhesives
2.2.3.4 Lignin-Based Adhesives
2.2.3.5 Unsaturated Oils
2.2.3.6 Liquefied Wood
2.2.3.7 Pyrolysis Products
2.2.3.8 Mimicking Nature and Bio-Inspiration
2.2.3.9 Detachable Bonding (Debonding) and Self-Healing Polymers (see also Section 5.5)
2.2.3.10 Mycelium Biocomposites
2.2.3.11 Nanomaterials
2.2.3.12 Replacement of Synthetic Raw Materials by Natural Components from Bio-Refineries
2.2.3.13 Crosslinkers
2.2.4 Thermoplastic Adhesives
2.2.4.1 PVAc
2.2.4.2 Hot Melts
2.2.4.3 Polylactic Acid (PLA)
2.3 Additives and Adhesive Mix Formulations
2.3.1 Fillers and Extenders
2.3.2 Hydrophobing Agents (Paraffins, Wax)
2.3.3 Flame-Retardant Agents, Fire-Retardant Treatment of Wood
2.4 Analysis and Test Methods (Composition and Properties) for Adhesives
2.4.1 Molar Mass Distribution (MWD) and Molar Mass Averages
2.4.2 Spectroscopic Methods and Determination of the Molecular Structure
2.4.3 Crystallinity of Aminoplastic Condensation Resins
3. The Behavior of Components During and After the Application of the Adhesive
3.1 Wetting Behavior
3.1.1 Wetting Behavior of Solid Wood and Aging of Wood Surfaces
3.1.2 Inactivation of Wood Surfaces, Aging of Wood Surfaces, Chemical Weak Boundary Layer (CWBL)
3.1.3 Wetting and Penetration Studies on Wood-Based Panels
3.2 Penetration Behavior
3.2.1 Penetration into Wood Tissue
3.2.2 Diffusion of an Adhesive into Cell Walls (Infiltration)
3.3 Application Technology of the Adhesive
3.3.1 Adhesive Resin Mixes
3.3.2 Technique of Application of the Resin on Solid Wood and Veneers
3.3.3 Techniques of Application of the Adhesive on Particles and Distribution of the Adhesive
3.3.4 Adhesive Spread on Strands in the OSB Production
3.3.5 Fiber Blending
3.3.6 Determination of the Resination Factor
3.4 Water Balance Before Pressing
3.4.1 Wood Moisture Content (MC) Before and After the Application of the Adhesive
3.4.2 Open and Closed Assembly Time
3.4.3 Wet (Green) Gluing
3.5 Forming Process
3.5.1 Modeling of Mats for Wood-Based Panels
3.5.2 Orientation of Particles and Strands
3.5.3 Ratio of Densification (Compaction Ratio, Compression Ratio)
3.5.4 Reinforcement of Mats and Boards
4. The Behavior of Components During the Press Cycle
4.1 Press Technology
4.1.1 Hot-Press Strategy
4.1.2 Heating Up a Particle or Fiber Mat, Gas Permeability
4.1.3 Water Balance and Steam Pressure
4.2 Behavior of Wood During the Press Cycle
4.2.1 Wood Strength Depending on Temperature, Moisture Content, and Densification of the Wood Structure
4.2.2 Chemical and Thermal Impact on Wood, Thermal Degradation of Wood Components
4.3 Behavior of the Adhesive During the Press Cycle
4.3.1 Chemical Curing of Formaldehyde-Based Condensation Resins
4.3.1.1 pH Drop and Buffering Behavior of Aminoplastic Resins (See also Sections 2.2.1.1 and 2.2.1.4)
4.3.1.2 Addition of Chemicals During the Hot-Press Cycle
4.3.1.3 Gel Times and Pot Life of Formaldehyde-Based Adhesives Resins
4.3.1.4 Differential Thermoanalysis (DTA) and Differential Scanning Calorimetry (DSC)
4.3.1.5 Dielectric Thermal Analysis (DETA), Dielectric Analysis (DEA)
4.3.1.6 Arrhenius Plots and Apparent Activation Energy Ea for the Gelation Process and the Formation of Bond Strength
4.3.2 Mechanical Hardening and Monitoring the Development of Bond Strength
4.3.2.1 Rheological Characterization, Thermal Scanning Rheometry (TSR)
4.3.2.2 Dynamic Mechanical (Thermal) Analysis (DMA, DMTA) and Thermomechanical Analysis (TMA)
4.3.2.3 Torsional Braid Analysis (TBA)
4.3.2.4 Development of Bond Strength and Automatic Bonding Evaluation System (ABES)
4.3.3 Correlations Between Chemical Curing, Mechanical Curing, and the Development of Bond Strength
4.3.4 Emissions During the Press Cycle
4.3.4.1 Formaldehyde Emission During the Production of Wood-Based Panels
4.3.4.2 VOC Emissions
4.4 Generating Bondlines and Panels During the Press Cycle
4.4.1 Formation of Bondlines
4.4.2 Compression of Particle and Fiber Mats and Formation of the Density Profile
4.4.3 Simulation Models for the Production Process of Wood-Based Panels
4.5 Theories of Bonding
4.5.1 Basics of Adhesive Bonding
4.5.1.1 Cohesion
4.5.1.2 Adhesion
4.5.2 Bonding Theories (“How Does Wood Bonding Really Work?”)
4.5.2.1 Secondary Forces and Physical Bonding
4.5.2.2 Covalent Chemical Bonding Between Wood Surface and Adhesive
4.5.2.3 Mechanical Anchoring (Interlocking) of the Adhesive in Wood (Mechanical Adhesion)
4.5.2.4 Autoadhesion (Diffusion Theory)
4.6 Wood Welding
5. Bonded Products
5.1 Post-Press Cycle Technology
5.1.1 Cooling, Hot Stacking, and Maturing Conditions (Temperature and Duration)
5.1.2 Post-Treatment Procedures
5.1.2.1 Steam Post-Treatment
5.1.2.2 Heat Post-Treatment
5.2 Consolidated Bondline
5.2.1 Test Methods for Hardened Adhesives
5.2.1.1 Chemical, Physical, and Physico-Chemical Tests, and Content of Residual Monomers
5.2.1.2 X-Ray Scattering Methods
5.2.1.3 Mechanical Tests on Solidified/Hardened Adhesive Films
5.2.2 Characterization of a Bondline
5.2.2.1 Microstructure and Morphology of a Bondline
5.2.2.2 Mechanical Properties of a Bondline
5.2.3 Bondlines Under Strain, Stress, and Fracture
5.2.3.1 Fracture Behavior of a Bondline and of Wood-Based Panels
5.2.3.2 Strain and Stress Distribution in Adhesive Joints and Wood-Based Panels
5.3 Testing and Properties of Wood-Based Panels
5.3.1 Density and Microstructure of Wood-Based Panels
5.3.1.1 Density and Density Distribution
5.3.1.2 Wood-Based Panels with Low Density
5.3.1.3 Microstructure of Wood-Based Panels
5.3.2 Mechanical Properties
5.3.2.1 Mechanics of Wood-Based Panels
5.3.2.2 Fracture Toughness of Boards (See Also Section 5.2.3.1)
5.3.3 Hygroscopic Properties
5.3.3.1 Equilibrium Moisture Content
5.3.3.2 Thickness Swelling and Water Absorption
5.3.4 Spectroscopic Analysis of Wood-Based Panels
5.3.5 Environmental Impact on Bondlines and Wood-Based Panels
5.3.5.1 Durability (Permanence) of Bondlines and Wood-Based Panels
5.3.5.2 Influence of Temperature and Moisture Content on Wood Joints and Wood-Based Panels
5.3.6 Mechanical Modeling and Prediction of Board Properties
5.4 Emissions
5.4.1 Subsequent Formaldehyde Emission from Wood-Based Panels
5.4.1.1 Test Methods for the Subsequent Formaldehyde Emission and Correlations Between the Various Test Methods
5.4.1.2 Regulations Concerning the Subsequent Formaldehyde Emission
5.4.2 Volatile Organic Compounds (VOC, SVOC, and VVOC)
5.4.3 Acids
5.5 Recycling of Wood and Wood-Based Panels and Furniture
5.5.1 Recycling of Particleboards and Furniture
5.5.2 Recycling of Fiberboards and MDF
List of Abbreviations
References
Index


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