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Submit a ProposalAtomic Layer Deposition
 | Principles, Characteristics, and Nanotechnology Applications Edited by Tommi Kääriäinen, David Cameron, Marja-Leena Kääriäinen, and Arthur Sherman Copyright: 2013 | Status: Published ISBN: 9781118062777 | Hardcover | 272 pages | 167 illustrations Price: $195 USD  |
One Line Description
This is the first practical ALD book which goes extensively into applications as well as the foundations of theory, including fundamental aspects such as films and materials.
Audience
Scientists and engineers in diverse fields of chemistry, materials science and physics who develop the ultra-thin film deposition processes and manufacturing technology facilitating industrial applications.Atomic Layer Deposition is highly suitable for use in training in the industrial setting as well as for a graduate-level course in atomic layer deposition.
Scientists and engineers in diverse fields of chemistry, materials science and physics who develop the ultra-thin film deposition processes and manufacturing technology facilitating industrial applications.Atomic Layer Deposition is highly suitable for use in training in the industrial setting as well as for a graduate-level course in atomic layer deposition.
Description
Atomic Layer Deposition: Principles, Characteristics, and Nanotechnology Applications is a new edition of Atomic Layer Deposition for Nanotechnology, authored by Arthur Sherman and published in 2008. The new edition has been thoroughly updated to cover new developments in process configuration, such as roll-to-roll manufacturing, and has been extended to highlight industrial applications.
ALD technology is being adopted by manufacturers all over the world, making Atomic Layer Deposition: Principles, Characteristics, and Nanotechnology Applications an indispensable title. ALD has become of paramount importance in a number of applications in recent years. This is particularly true for microelectronics and MEMS devices because of the economic pressure driving devices to ever smaller dimensions. Nonmicroelectronics applications, where the characteristic uniformity and conformality properties of ALD are prized, have gained great potential as well. In particular, emerging industrial applications such as organic and flexible electronics, solar cells, optical coatings, silver tarnish prevention, coating catalytic membranes, and solid fuel cells are the most notable.
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Atomic Layer Deposition: Principles, Characteristics, and Nanotechnology Applications is a new edition of Atomic Layer Deposition for Nanotechnology, authored by Arthur Sherman and published in 2008. The new edition has been thoroughly updated to cover new developments in process configuration, such as roll-to-roll manufacturing, and has been extended to highlight industrial applications.
ALD technology is being adopted by manufacturers all over the world, making Atomic Layer Deposition: Principles, Characteristics, and Nanotechnology Applications an indispensable title. ALD has become of paramount importance in a number of applications in recent years. This is particularly true for microelectronics and MEMS devices because of the economic pressure driving devices to ever smaller dimensions. Nonmicroelectronics applications, where the characteristic uniformity and conformality properties of ALD are prized, have gained great potential as well. In particular, emerging industrial applications such as organic and flexible electronics, solar cells, optical coatings, silver tarnish prevention, coating catalytic membranes, and solid fuel cells are the most notable.
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Author / Editor Details
Tommi Kääriäinen is a researcher at the Advanced Surface Technology Research Laboratory (ASTRaL) in Lappeenranta University of Technology (LUT), Finland. He has over nine years of experience in thin film deposition and analytical techniques. He has especially focused on atomic layer deposition (ALD) at low temperatures and recently on spatial and roll-to-roll ALD.
Tommi Kääriäinen is a researcher at the Advanced Surface Technology Research Laboratory (ASTRaL) in Lappeenranta University of Technology (LUT), Finland. He has over nine years of experience in thin film deposition and analytical techniques. He has especially focused on atomic layer deposition (ALD) at low temperatures and recently on spatial and roll-to-roll ALD.
David Cameron received his BSc in electrical and electronic engineering from the University of Glasgow in 1972. In 2004, he joined LUT as Professor of Material Technology and Director of ASTRaL. His research career has been in the area of thin film deposition and since joining ASTRaL, his work has focused on ALD. He has also worked on molecular beam epitaxy, plasma chemical vapour deposition, magnetron sputtering,and sol-gel deposition.
Marja-Leena Kääriäinen has conducted ALD research for over 10 years. Her focus has been on the growth and structure of nanoscale metal oxide films. She has a particular interest in the photoactivity, photocatalytic activity, and antibacterial properties of ALD-grown thin films. Her background is in chemical engineering,which she studied at LUT and Michigan Technological University. Currently, she is a researcher at ASTRaL.
Arthur Sherman has 60 years of industrial experience, which includes almost 20 years with General Electric,seven years on the corporate staff of RCA, several years at Applied Materials, and six years at Varian Associates. He earned a master’s degree in aeronautical engineering at Princeton University and a PhD at the University of Pennsylvania. He has published extensively, including approximately 50 research papers published in archive journals and three scientific monographs.
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Table of Contents
Foreword
Preface
1 Fundamentals of Atomic Layer Deposition
1.1 Chemical Vapour Deposition
1.1.1 Thermal CVD
1.1.2 Plasma Enhanced CVD (PECVD)
1.2 Vapour Adsorption
1.2.1 Physisorption
1.2.2 Chemisorption
1.3 Atomic Layer Deposition (ALD)
1.3.1 Thermal ALD Processes
1.3.2 Radical Enhanced ALD (REALD)
1.3.3 Spatial ALD (SALD)
2 Elemental Semiconductor Epitaxial Films
2.1 Epitaxial Silicon
2.1.1 Dichlorosilane Processes
2.1.2 Other Processes
2.1.3 Epitaxial Germanium
3 III-V Semiconductor Films
3.1 Gallium Arsenide
3.1.1 Organometallic Precursors
3.1.2 Halogen Precursors
3.2 Other III-V Semiconductor Films
3.3 Applications
3.3.1 Photonic Structures
3.3.2 Transistors
4 Oxide films
4.1 Introduction
4.2 Aluminum Oxide
4.2.1 Processes and Properties of Aluminum Oxide
4.3 Titanium Dioxide
4.3.1 Processes and Properties of TiO2
4.4 Zinc Oxide
4.4.1 Processes and Properties of ZnO
4.5 Zirconium Dioxide
4.5.1 Processes and Properties of ZrO2
4.6 Hafnium Dioxide
4.6.1 Processes and Properties of HfO2
4.7 Other Oxides
4.7.1 Tin Oxide
4.7.2 Indium Oxide
4.7.3 Tantalum Oxide
4.8 Mixed Oxides and Nanolaminates
4.8.1 Mixed Oxide Processes
4.8.2 Nanolaminate Oxides
4.9 Multilayers
5 Nitrides and Other Compounds
5.1 Introduction
5.2 Nitrides
5.2.1 Transition Metal Nitrides
5.2.2 Group III Nitrides
5.2.3 Group IV Nitrides
5.2.4 Mixed Nitrides
5.3 Chalcogenides
5.4 Other Compounds
6 Metals
6.1 Introduction
6.2 Noble Metals
6.2.1 Silver Processes and Applications
6.2.2 Ruthenium Processes and Applications
6.2.3 Platinum and Palladium Processes and
Applications
6.2.4 Rhrodium Processes and Applications
6.2.5 Iridium Processes and Applications
6.3 Titanium
6.4 Tantalum
6.5 Aluminum
6.6 Copper
6.7 Other Transition Metals
7 Organic and Hybrid Materials
7.1 Introduction
7.2 Organic layers
7.3 Hybrid Organic-inorganic Layers.
7.4 Applications of Organic and Hybrid Films
8 ALD Applications and Industry
8.1 Introduction
8.2 MEMS/NEMS
8.3 Thin Film Magnetic Heads
8.4 Coating Nanoparticles, Nanomaterials and
Porous Objects
8.5 Optical Coatings
8.6 Thin Film Electroluminescent Displays
8.7 Solar Cells
8.8 Anti-corrosion Layers
8.9 Opportunities in Organic Electronics
8.10 ALD Tool Manufacturers and Coating Providers
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Foreword
Preface
1 Fundamentals of Atomic Layer Deposition
1.1 Chemical Vapour Deposition
1.1.1 Thermal CVD
1.1.2 Plasma Enhanced CVD (PECVD)
1.2 Vapour Adsorption
1.2.1 Physisorption
1.2.2 Chemisorption
1.3 Atomic Layer Deposition (ALD)
1.3.1 Thermal ALD Processes
1.3.2 Radical Enhanced ALD (REALD)
1.3.3 Spatial ALD (SALD)
2 Elemental Semiconductor Epitaxial Films
2.1 Epitaxial Silicon
2.1.1 Dichlorosilane Processes
2.1.2 Other Processes
2.1.3 Epitaxial Germanium
3 III-V Semiconductor Films
3.1 Gallium Arsenide
3.1.1 Organometallic Precursors
3.1.2 Halogen Precursors
3.2 Other III-V Semiconductor Films
3.3 Applications
3.3.1 Photonic Structures
3.3.2 Transistors
4 Oxide films
4.1 Introduction
4.2 Aluminum Oxide
4.2.1 Processes and Properties of Aluminum Oxide
4.3 Titanium Dioxide
4.3.1 Processes and Properties of TiO2
4.4 Zinc Oxide
4.4.1 Processes and Properties of ZnO
4.5 Zirconium Dioxide
4.5.1 Processes and Properties of ZrO2
4.6 Hafnium Dioxide
4.6.1 Processes and Properties of HfO2
4.7 Other Oxides
4.7.1 Tin Oxide
4.7.2 Indium Oxide
4.7.3 Tantalum Oxide
4.8 Mixed Oxides and Nanolaminates
4.8.1 Mixed Oxide Processes
4.8.2 Nanolaminate Oxides
4.9 Multilayers
5 Nitrides and Other Compounds
5.1 Introduction
5.2 Nitrides
5.2.1 Transition Metal Nitrides
5.2.2 Group III Nitrides
5.2.3 Group IV Nitrides
5.2.4 Mixed Nitrides
5.3 Chalcogenides
5.4 Other Compounds
6 Metals
6.1 Introduction
6.2 Noble Metals
6.2.1 Silver Processes and Applications
6.2.2 Ruthenium Processes and Applications
6.2.3 Platinum and Palladium Processes and
Applications
6.2.4 Rhrodium Processes and Applications
6.2.5 Iridium Processes and Applications
6.3 Titanium
6.4 Tantalum
6.5 Aluminum
6.6 Copper
6.7 Other Transition Metals
7 Organic and Hybrid Materials
7.1 Introduction
7.2 Organic layers
7.3 Hybrid Organic-inorganic Layers.
7.4 Applications of Organic and Hybrid Films
8 ALD Applications and Industry
8.1 Introduction
8.2 MEMS/NEMS
8.3 Thin Film Magnetic Heads
8.4 Coating Nanoparticles, Nanomaterials and
Porous Objects
8.5 Optical Coatings
8.6 Thin Film Electroluminescent Displays
8.7 Solar Cells
8.8 Anti-corrosion Layers
8.9 Opportunities in Organic Electronics
8.10 ALD Tool Manufacturers and Coating Providers
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BISAC SUBJECT HEADINGS
TEC021000: TECHNOLOGY & ENGINEERING / Materials Science
TEC027000: TECHNOLOGY & ENGINEERING / Nanotechnology & MEMS
SCI077000: SCIENCE / Physics / Condensed Matter
BIC CODES
TDCK: Surface-Coating Technology
TGM: Materials Science
TBN: Nanotechnology
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