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Submit a ProposalEncapsulation Nanotechnologies
 | Edited by Vikas Mittal Copyright: 2013 | Status: Published ISBN: 9781118344552 | Hardcover | 447 pages | 202 illustrations Price: $195 USD  |
One Line Description
This unique and comprehensive book covers all the recent physical, chemical, and mechanical advancements in encapsulation nanotechnologies.
Audience
Materials scientists, chemists and engineers working both in academia and various industrial sectors such as biotechnology, pharmaceutical, food, cosmetics, packaging,and microelectronics.
Materials scientists, chemists and engineers working both in academia and various industrial sectors such as biotechnology, pharmaceutical, food, cosmetics, packaging,and microelectronics.
Description
The encapsulation process is prevalent in the evolutionary processes of nature, where nature protects the materials from the environment by engulfing them in a suitable shell. These natural processes are well-known and have been applied to numerous processes in the pharmaceutical, food, agricultural, and cosmetics industries. In recent years, due to the increased understanding of the material properties and behaviors at the nanoscale, research in the encapsulation field has also moved to the generation, for example, of nanocapsules and nanocontainers. The processes used to generate such capsules have also undergone significant developments. Various technologies based on chemical, physical and physic-chemical synthesis methods have been developed and applied successfully to generate encapsulated materials. Owing to the high potential of the developed technologies and products in a large number of commercial processes, it is of significance to compile the recent technological advancements in a comprehensive volume. This volume not only introduces the subject of encapsulation to readers new to the field, but also serves as a reference for experts working in this area.
Highlights of Encapsulation Nanotechnologies include:
• The copper encapsulation of carbon nanotubes
• Various aspects of the application of fluid-bed technology for the coating and encapsulation processes
• The use of the electrospinning technique for encapsulation
• The concept of microencapsulation by interfacial polymerization
• Provides an overview of recent progress in encapsulation technologies for organic thin-film transistors (OTFTs)
• Describes the initiated chemical vapor deposition (iCVD) process which is essential for large-scale application in hybrid gas barriers
• Gives the current status of polymer capsule technology
• Demonstrates the potential of encapsulated ionic liquids (IL) within porous moieties in the proton exchange membranes field
• Reviews the encapsulation and co-precipitation processes based on the use of supercritical fluids, i.e., carbon dioxide.
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The encapsulation process is prevalent in the evolutionary processes of nature, where nature protects the materials from the environment by engulfing them in a suitable shell. These natural processes are well-known and have been applied to numerous processes in the pharmaceutical, food, agricultural, and cosmetics industries. In recent years, due to the increased understanding of the material properties and behaviors at the nanoscale, research in the encapsulation field has also moved to the generation, for example, of nanocapsules and nanocontainers. The processes used to generate such capsules have also undergone significant developments. Various technologies based on chemical, physical and physic-chemical synthesis methods have been developed and applied successfully to generate encapsulated materials. Owing to the high potential of the developed technologies and products in a large number of commercial processes, it is of significance to compile the recent technological advancements in a comprehensive volume. This volume not only introduces the subject of encapsulation to readers new to the field, but also serves as a reference for experts working in this area.
Highlights of Encapsulation Nanotechnologies include:
• The copper encapsulation of carbon nanotubes
• Various aspects of the application of fluid-bed technology for the coating and encapsulation processes
• The use of the electrospinning technique for encapsulation
• The concept of microencapsulation by interfacial polymerization
• Provides an overview of recent progress in encapsulation technologies for organic thin-film transistors (OTFTs)
• Describes the initiated chemical vapor deposition (iCVD) process which is essential for large-scale application in hybrid gas barriers
• Gives the current status of polymer capsule technology
• Demonstrates the potential of encapsulated ionic liquids (IL) within porous moieties in the proton exchange membranes field
• Reviews the encapsulation and co-precipitation processes based on the use of supercritical fluids, i.e., carbon dioxide.
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Author / Editor Details
Vikas Mittal is an assistant professor at the Department of Chemical Engineering of The Petroleum Institute. He obtained his PhD in 2006 from the Swiss Federal Institute of Technology in Zurich, Switzerland.He has also worked as a polymer engineer at BASF Polymer Research in Ludwigshafen, Germany. Dr. Mittal has edited 5 other successful books for the Wiley-Scrivener imprint.
Vikas Mittal is an assistant professor at the Department of Chemical Engineering of The Petroleum Institute. He obtained his PhD in 2006 from the Swiss Federal Institute of Technology in Zurich, Switzerland.He has also worked as a polymer engineer at BASF Polymer Research in Ludwigshafen, Germany. Dr. Mittal has edited 5 other successful books for the Wiley-Scrivener imprint.
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Table of Contents
Preface
1 Copper Encapsulation of Multi-Walled Carbon Nanotubes
Yong Sun and Boateng Onwona-Agyeman
2 Novel Nanocomposites: Intercalation of Ionically Conductive Polymers into Molybdic Acid
Rabin Bissessur, Blakney Hopkins and Douglas C. Dahn
3 Fluid-Bed Technology for Encapsulation and Coating Purposes
Roman G. Szafran
4 Use of Electrospinning for Encapsulation
Rocio Prez-Masia, Maria Jos Fabra, Jose Maria Lagar ³n and Amparo L ³pez-Rubio
5 Microencapsulation by Interfacial Polymerization
Fabien Salan
6 Encapsulation of Silica Particles by a Thin Shell of Poly(Methyl) Methacrylate
Isidora Freris and Alvise Benedetti
7 Organic Thin-Film Transistors with Solution-Processed Encapsulation
Feng-Yu Tsai and Yu Fu
8 Tunable Encapsulation Property of Amphiphilic Polymer Based on Hyperbranched Polyethylenimine
Decheng Wan and Toshifumi Satoh
9 Polymer Layers by Initiated CVD for Thin Film Gas Barrier Encapsulation
D.A. Spee, J.K. Rath and R.E.I. Schropp
10 Polymeric Hollow Particles for Encapsulation of Chemical Molecules
Jong Myung Park
11 Protic Ionic Liquids Confinement in Macro, Meso and Microporous Materials for Proton Conduction
A. Eguizabal and M.P. Pina
12 Encapsulation Methods with Supercritical Carbon Dioxide: Basis and Applications
Soraya Rodriguez-Rojo, ngel Martin and Maria Jos Cocero
Index
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Preface
1 Copper Encapsulation of Multi-Walled Carbon Nanotubes
Yong Sun and Boateng Onwona-Agyeman
2 Novel Nanocomposites: Intercalation of Ionically Conductive Polymers into Molybdic Acid
Rabin Bissessur, Blakney Hopkins and Douglas C. Dahn
3 Fluid-Bed Technology for Encapsulation and Coating Purposes
Roman G. Szafran
4 Use of Electrospinning for Encapsulation
Rocio Prez-Masia, Maria Jos Fabra, Jose Maria Lagar ³n and Amparo L ³pez-Rubio
5 Microencapsulation by Interfacial Polymerization
Fabien Salan
6 Encapsulation of Silica Particles by a Thin Shell of Poly(Methyl) Methacrylate
Isidora Freris and Alvise Benedetti
7 Organic Thin-Film Transistors with Solution-Processed Encapsulation
Feng-Yu Tsai and Yu Fu
8 Tunable Encapsulation Property of Amphiphilic Polymer Based on Hyperbranched Polyethylenimine
Decheng Wan and Toshifumi Satoh
9 Polymer Layers by Initiated CVD for Thin Film Gas Barrier Encapsulation
D.A. Spee, J.K. Rath and R.E.I. Schropp
10 Polymeric Hollow Particles for Encapsulation of Chemical Molecules
Jong Myung Park
11 Protic Ionic Liquids Confinement in Macro, Meso and Microporous Materials for Proton Conduction
A. Eguizabal and M.P. Pina
12 Encapsulation Methods with Supercritical Carbon Dioxide: Basis and Applications
Soraya Rodriguez-Rojo, ngel Martin and Maria Jos Cocero
Index
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BISAC SUBJECT HEADINGS
TEC027000: Technology & Engineering/Nanotechnology
TEC021000: Technology & Engineering/Materials Science
TEC009010: Technology & Engineering/Chemical & Biochemical
BIC CODES
TBN: Nanotechnology
TGM: Materials Science
TDCB: Chemical Engineering
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