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Submit a ProposalAdvances in Modeling and Design of Adhesively Bonded Systems
 | Edited by S. Kumar and K.L. Mittal Series: Adhesion and Adhesives: Fundamental and Applied Aspects Copyright: 2013 | Status: Published ISBN: 9781118686379 | Hardcover | 278 pages | 144 illustrations Price: $195 USD  |
One Line Description
The book comprehensively charts a way for industry to employ adhesively bonded joints to make systems more efficient and cost-effective
Audience
The book is central to a range of engineers including mechanical, reliability,construction and surface engineers as well as materials scientists who are engaged in the mechanics of structural adhesive joints. Industries that will use this book include aerospace, electronics, biomedical, automotive, ship building, and construction.
The book is central to a range of engineers including mechanical, reliability,construction and surface engineers as well as materials scientists who are engaged in the mechanics of structural adhesive joints. Industries that will use this book include aerospace, electronics, biomedical, automotive, ship building, and construction.
Description
Adhesively bonded systems have found applications in a wide spectrum of industries (e.g., aerospace, electronics, construction, ship building, biomedical, etc.) for a variety of purposes. Emerging adhesive materials with improved mechanical properties have allowed adhesion strength approaching that of the bonded materials themselves. Due to advances in adhesive materials and the many potential merits that adhesive bonding offers, adhesive bonding has replaced other joining methods in many applications.
Containing nine articles written by world-renowned experts, the book deals with the advances in theoretical and computational modeling as well as the design and experimental aspects of adhesively bonded structural systems. Stress analysis and strength prediction of adhesively bonded structural systems, considering a range of material models under a variety of loading conditions, are discussed. Finite element modeling using macro-elements is elaborated on. Recent developments in modeling and experimental aspects of bonded systems with graded adhesive layers and dual adhesives are described. Simulation of progressive damage in bonded joints is addressed. A novel vibration-based approach to detect disbonding and delamination in composite joints is also discussed.
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Adhesively bonded systems have found applications in a wide spectrum of industries (e.g., aerospace, electronics, construction, ship building, biomedical, etc.) for a variety of purposes. Emerging adhesive materials with improved mechanical properties have allowed adhesion strength approaching that of the bonded materials themselves. Due to advances in adhesive materials and the many potential merits that adhesive bonding offers, adhesive bonding has replaced other joining methods in many applications.
Containing nine articles written by world-renowned experts, the book deals with the advances in theoretical and computational modeling as well as the design and experimental aspects of adhesively bonded structural systems. Stress analysis and strength prediction of adhesively bonded structural systems, considering a range of material models under a variety of loading conditions, are discussed. Finite element modeling using macro-elements is elaborated on. Recent developments in modeling and experimental aspects of bonded systems with graded adhesive layers and dual adhesives are described. Simulation of progressive damage in bonded joints is addressed. A novel vibration-based approach to detect disbonding and delamination in composite joints is also discussed.
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Author / Editor Details
S. Kumar is currently a faculty member at the Masdar Institute of Science and Technology, Abu Dhabi, UAE. He obtained his PhD in solid mechanics and materials engineering from the University of Oxford and an MPhil from the University of Southampton. He has won several awards including the EPSRC Award at Oxford and a Rolls-Royce/DTI Fellowship at Southampton. He is a senior member of the AIAA and is an active member of ASME and SAA UK.
S. Kumar is currently a faculty member at the Masdar Institute of Science and Technology, Abu Dhabi, UAE. He obtained his PhD in solid mechanics and materials engineering from the University of Oxford and an MPhil from the University of Southampton. He has won several awards including the EPSRC Award at Oxford and a Rolls-Royce/DTI Fellowship at Southampton. He is a senior member of the AIAA and is an active member of ASME and SAA UK.
Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of
adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Skłodowska University,
Lublin, Poland. He is the editor of more than 110 volumes dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning,and surfactants.
adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Skłodowska University,
Lublin, Poland. He is the editor of more than 110 volumes dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning,and surfactants.
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Table of Contents
Preface
Acknowledgements
1 Stress and Strain Analysis of Symmetric Composite Single Lap Joints Under Combined Tension and In-Plane Shear Loading
Jungmin Lee and Hyonny Kim
2 Finite Element Modeling of Viscoelastic Behavior and Interface Damage in Adhesively Bonded Joints
Feifei Cheng, . zg zsoy and J.N. Reddy
3 Modeling of Cylindrical Joints with a Functionally Graded Adhesive Interlayer
S. Kumar
4 A Simplified Stress Analysis of Bonded Joints Using Macro-Elements
E. Paroissien, F. Lachaud, and T. Jacobs
5 Simulation of Bonded Joints Failure using Progressive Mixed-Mode Damage Models
M.F.S.F. de Moura and J.A.G. Chousal
6 Testing of Dual Adhesive Ceramic-Metal Joints for Aerospace Applications
E.A.S. Marques, Lucas F.M. da Silva and C. Sato
7 Modelling of Composite Sandwich T-Joints Under Tension and Bending
J.H. Tang, I. Sridhar, G.B. Chai and C.H. Ong
8 Strength Prediction Methods for Adhesively
Bonded Lap Joints between Composite -- Composite/Metal Adherends
P.K. Sahoo, B. Dattaguru, C.M. Manjunatha and C.R.L. Murthy
9 Interface Failure Detection in Adhesively Bonded Composite Joints Using a Novel Vibration-Based Approach
Ramadan A. Esmaeel and Farid Taheri
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Preface
Acknowledgements
1 Stress and Strain Analysis of Symmetric Composite Single Lap Joints Under Combined Tension and In-Plane Shear Loading
Jungmin Lee and Hyonny Kim
2 Finite Element Modeling of Viscoelastic Behavior and Interface Damage in Adhesively Bonded Joints
Feifei Cheng, . zg zsoy and J.N. Reddy
3 Modeling of Cylindrical Joints with a Functionally Graded Adhesive Interlayer
S. Kumar
4 A Simplified Stress Analysis of Bonded Joints Using Macro-Elements
E. Paroissien, F. Lachaud, and T. Jacobs
5 Simulation of Bonded Joints Failure using Progressive Mixed-Mode Damage Models
M.F.S.F. de Moura and J.A.G. Chousal
6 Testing of Dual Adhesive Ceramic-Metal Joints for Aerospace Applications
E.A.S. Marques, Lucas F.M. da Silva and C. Sato
7 Modelling of Composite Sandwich T-Joints Under Tension and Bending
J.H. Tang, I. Sridhar, G.B. Chai and C.H. Ong
8 Strength Prediction Methods for Adhesively
Bonded Lap Joints between Composite -- Composite/Metal Adherends
P.K. Sahoo, B. Dattaguru, C.M. Manjunatha and C.R.L. Murthy
9 Interface Failure Detection in Adhesively Bonded Composite Joints Using a Novel Vibration-Based Approach
Ramadan A. Esmaeel and Farid Taheri
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BISAC SUBJECT HEADINGS
SCI055000: Science/Physics/General
TEC021000: Technology & Engineering/Materials Science
TEC009060: Technology & Engineering/Industrial Engineering
BIC CODES
TDCK: Surface-coatings Technology
TGM: Materials Science
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