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Submit a ProposalAdhesion in Microelectronics
 | Edited by K.L. Mittal and Tanweer Ahsan Series: Adhesion and Adhesives: Fundamental and Applied Aspects Copyright: 2014 | Status: Published ISBN: 9781118831335 | Hardcover | 357 pages Price: $200.95 USD  |
One Line Description
Provides a comprehensive review with emphasis on recent developments in the area of adhesion relevant to the microelectronics industry
Audience
The book is of critical importance to materials scientists and electronics engineers involved or interested in understanding and achieving the required level of adhesion in the overall microelectronics industry, as well as R & D and manufacturing personnel in other industries, e.g, packaging, thin film technology, metallized plastics, encapsulation, printed circuit boards, etc.
The book is of critical importance to materials scientists and electronics engineers involved or interested in understanding and achieving the required level of adhesion in the overall microelectronics industry, as well as R & D and manufacturing personnel in other industries, e.g, packaging, thin film technology, metallized plastics, encapsulation, printed circuit boards, etc.
Description
The phenomenon of adhesion is of cardinal importance in the domain of microelectronics. For example adequate adhesion of thin films is sine qua non in integrated circuits; adhesion of polymeric and other materials is a must in devices; and adhesion of various materials is crucial in fabricating printed circuit boards. Although there has been a high tempo of R & D activity in the field, the information is scattered in a number of publication media. Up until to now, there has been no single easily accessible source where one can find the requisite information.
The rationale for compiling this comprehensive book on Adhesion in Microelectronics, therefore, is to provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Our intent in this book is to cover the various aspects of adhesion as they pertain to the field of microelectronics. The book contains 8 large chapters by leading experts in the field and is divided into three parts: Part 1: Adhesion: Fundamentals and Measurement; Part 2: Ways to Promote/Enhance Adhesion; and Part 3: Reliability and Failure Mechanisms.
Among the topics covered are:
• Various theories or mechanisms of adhesion
• Surface (physical or chemical) characterization of materials as it pertains to adhesion
• Surface cleaning as it pertains to adhesion
• Ways to improve adhesion
• Unraveling of interfacial interactions using an array of pertinent techniques
• Characterization of interfaces/interphases
• Polymer-polymer adhesion
• Metal-polymer adhesion (metallized polymers)
• Polymer adhesion to various substrates
• Adhesion of thin films
• Adhesion of underfills
• Adhesion of molding compounds
• Adhesion of different dielectric materials
• Delamination and reliability issues in packaged devices
• Interface mechanics and crack propagation
• Adhesion measurement of thin films and coatings
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The phenomenon of adhesion is of cardinal importance in the domain of microelectronics. For example adequate adhesion of thin films is sine qua non in integrated circuits; adhesion of polymeric and other materials is a must in devices; and adhesion of various materials is crucial in fabricating printed circuit boards. Although there has been a high tempo of R & D activity in the field, the information is scattered in a number of publication media. Up until to now, there has been no single easily accessible source where one can find the requisite information.
The rationale for compiling this comprehensive book on Adhesion in Microelectronics, therefore, is to provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Our intent in this book is to cover the various aspects of adhesion as they pertain to the field of microelectronics. The book contains 8 large chapters by leading experts in the field and is divided into three parts: Part 1: Adhesion: Fundamentals and Measurement; Part 2: Ways to Promote/Enhance Adhesion; and Part 3: Reliability and Failure Mechanisms.
Among the topics covered are:
• Various theories or mechanisms of adhesion
• Surface (physical or chemical) characterization of materials as it pertains to adhesion
• Surface cleaning as it pertains to adhesion
• Ways to improve adhesion
• Unraveling of interfacial interactions using an array of pertinent techniques
• Characterization of interfaces/interphases
• Polymer-polymer adhesion
• Metal-polymer adhesion (metallized polymers)
• Polymer adhesion to various substrates
• Adhesion of thin films
• Adhesion of underfills
• Adhesion of molding compounds
• Adhesion of different dielectric materials
• Delamination and reliability issues in packaged devices
• Interface mechanics and crack propagation
• Adhesion measurement of thin films and coatings
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Author / Editor Details
Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Skłodowska University, Lublin, Poland. He is the editor of more than 115 books dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives.
Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Skłodowska University, Lublin, Poland. He is the editor of more than 115 books dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives.
Tanweer Ahsan is a materials and adhesion scientist at Henkel’s Electronic Materials Research and Development facility located in Irvine, California. He holds a bachelor’s degree with honors in applied chemistry and a PhD in surface/physical chemistry, both from Brunel, The University of West London, UK. As a materials scientist, his interests are polymer-mineral interfacial chemistry, nano-composites, catalysts and catalytic processes, surface energetics and adhesion of polymer & plastics with inorganic and metal surfaces. He has numerous publications, presentations and US patents in electronic materials, catalysis and adhesion related areas.
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