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Submit a ProposalProgress in Adhesion and Adhesives, Volume 4
 | Edited by K.L. Mittal Copyright: 2019 | Status: Published ISBN: 9781119625254 | Hardcover | 456 pages | 225 illustrations Price: $225 USD  |
One Line Description
A solid collection of interdisciplinary review articles on the latest developments in adhesion science and adhesives technology
Audience
This book will be valuable and useful to researchers and technologists in adhesion science, materials science, composites, nanotechnology, polymer science, biomedical/dental fields, physics, surface and colloid chemistry in academia and industry.
This book will be valuable and useful to researchers and technologists in adhesion science, materials science, composites, nanotechnology, polymer science, biomedical/dental fields, physics, surface and colloid chemistry in academia and industry.
Description
With the ever-increasing amount of research being published, it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in many subjects representing the field of adhesion science and adhesives.
Based on the success of the preceding volumes in this series “Progress in Adhesion and Adhesives”), the present volume comprises 9 review articles published in Volume 6 (2018) of Reviews of Adhesion and Adhesives.
The subject of these reviews fall into the following general areas.
1. Adhesion to wood and wood bonds
2. Adhesive joints
3. Adhesion in microelectronic packaging
4. Surface modification
5. Contact angle, wettability and surface free energy.
The topics covered include: Adhesion phenomena in microelectronic packaging; adhesives for wood and lignocellulosic materials; adhesion to wood and lignocellulosic materials; adhesively bonded lap joints having bi-adhesive and modulus-graded bondlines; adhesion between compounded elastomers; applications of contact angle measurements in pharmaceuticals and foods; oxygen or ammonia plasma treatment of polyolefin surfaces; surface free energy determination of powders and particles; wood bonds; and dispersion adhesion forces between macroscopic objects.
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With the ever-increasing amount of research being published, it is a Herculean task to be fully conversant with the latest research developments in any field, and the arena of adhesion and adhesives is no exception. Thus, topical review articles provide an alternate and very efficient way to stay abreast of the state-of-the-art in many subjects representing the field of adhesion science and adhesives.
Based on the success of the preceding volumes in this series “Progress in Adhesion and Adhesives”), the present volume comprises 9 review articles published in Volume 6 (2018) of Reviews of Adhesion and Adhesives.
The subject of these reviews fall into the following general areas.
1. Adhesion to wood and wood bonds
2. Adhesive joints
3. Adhesion in microelectronic packaging
4. Surface modification
5. Contact angle, wettability and surface free energy.
The topics covered include: Adhesion phenomena in microelectronic packaging; adhesives for wood and lignocellulosic materials; adhesion to wood and lignocellulosic materials; adhesively bonded lap joints having bi-adhesive and modulus-graded bondlines; adhesion between compounded elastomers; applications of contact angle measurements in pharmaceuticals and foods; oxygen or ammonia plasma treatment of polyolefin surfaces; surface free energy determination of powders and particles; wood bonds; and dispersion adhesion forces between macroscopic objects.
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Author / Editor Details
Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Skłodowska University, Lublin, Poland. He is the editor of more than 130 books dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives.
Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Skłodowska University, Lublin, Poland. He is the editor of more than 130 books dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives.
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Table of Contents
Preface
1 Characterization of Phase Transition Points for Topological Gapped Systems 1
Linhu Li and Shu Chen
2 Topological Insulator Materials for Advanced Optoelectronic Devices
Zengji Yue, Xiaolin Wang and Min Gu
3 Topological Insulator Thin Films and Artificial Topological Superconductors
Hao Zheng, Yaoyi Li and Jin-Feng Jia
4 Topological Matter in the Absence of Translational Invariance
Koji Kobayashi, Tomi Ohtsuki and Ken-Ichiro Imura
5 Changing the Topology of Electronic Systems Through Interactions or Disorder
M.A.N. Araújo, E.V. Castro and P.D. Sacramento
. 6 Q-Switching Pulses Generation Using Topology Insulators as Saturable Absorber
Sulaiman Wadi Harun, Nurfarhanah Zulkipli, Ahmad Razif Muhammad and Anas Abdul Latiff
7 Topological Phase Transitions: Criticality, Universality, and Renormalization Group Approach
Wei Chen and Manfred Sigrist
8 Behaviour of Dielectric Materials Under Electron Irradiation in a SEM
Slim Fakhfakh, Khaled Raouadi and Omar Jbara
9 Photonic Crystal Fiber (PCF) is a New Paradigm for Realization of Topological Insulator
Gopinath Palai
10 Patterned 2D Thin Films Topological Insulators for Potential Plasmonic Applications
G. Padmalaya, E. Manikandan, S. Radha, B.S. Sreeja and P. Senthil Kumar
Index
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Preface
1 Characterization of Phase Transition Points for Topological Gapped Systems 1
Linhu Li and Shu Chen
2 Topological Insulator Materials for Advanced Optoelectronic Devices
Zengji Yue, Xiaolin Wang and Min Gu
3 Topological Insulator Thin Films and Artificial Topological Superconductors
Hao Zheng, Yaoyi Li and Jin-Feng Jia
4 Topological Matter in the Absence of Translational Invariance
Koji Kobayashi, Tomi Ohtsuki and Ken-Ichiro Imura
5 Changing the Topology of Electronic Systems Through Interactions or Disorder
M.A.N. Araújo, E.V. Castro and P.D. Sacramento
. 6 Q-Switching Pulses Generation Using Topology Insulators as Saturable Absorber
Sulaiman Wadi Harun, Nurfarhanah Zulkipli, Ahmad Razif Muhammad and Anas Abdul Latiff
7 Topological Phase Transitions: Criticality, Universality, and Renormalization Group Approach
Wei Chen and Manfred Sigrist
8 Behaviour of Dielectric Materials Under Electron Irradiation in a SEM
Slim Fakhfakh, Khaled Raouadi and Omar Jbara
9 Photonic Crystal Fiber (PCF) is a New Paradigm for Realization of Topological Insulator
Gopinath Palai
10 Patterned 2D Thin Films Topological Insulators for Potential Plasmonic Applications
G. Padmalaya, E. Manikandan, S. Radha, B.S. Sreeja and P. Senthil Kumar
Index
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